There are many types of CVD (Chemical Vapor Deposition), some of the major ones include:

LPCVD (Low Pressure Chemical Vapor Deposition): Performed at relatively low pressure and suitable for some material-sensitive applications.

PECVD (Plasma Enhanced Chemical Vapor Deposition): Deposition is achieved at lower temperatures by introducing a plasma to enhance the reaction.

MOCVD (Metal Organic Chemical Vapor Deposition): Uses metal organic compounds as precursors and is primarily used in semiconductor device manufacturing.

APCVD (Atmospheric Pressure Chemical Vapor Deposition): performed at atmospheric pressure and suitable for some special applications.

ALD (Atomic Layer Deposition): Atomic layer control of the material surface is achieved by introducing gas precursors layer by layer.

Each type of CVD has its own unique applications and advantages, and the specific choice depends on the nature of the coating required, the materials, and the preparation conditions.